Barrier layers in trenches and vias

ABSTRACT

A method of forming a semiconductor structure includes forming at least one trench in a dielectric layer, forming a barrier layer on a bottom of said at least one trench, sidewalls of said at least one trench and a top surface of the dielectric layer, the barrier layer having a non-uniform thickness, and selectively thinning at least a first portion of the barrier layer using one or more cycles comprising forming an oxidized layer in the first portion of the barrier layer using a neutral beam oxidation and removing the oxidized layer using an etching process.

BACKGROUND

The present application relates to semiconductors, and morespecifically, to techniques for forming semiconductor structures.Various semiconductors and other electronic structures use trenchesand/or vias to form connections between components thereof. Theformation of such interconnects however, is increasingly difficult assemiconductor and other electronic structures are made smaller.

SUMMARY

Embodiments of the invention provide techniques for forming barrierlayers in trenches and vias.

For example, in one embodiment a method of forming a semiconductorstructure comprises forming at least one trench in a dielectric layer,forming a barrier layer on a bottom of said at least one trench,sidewalls of said at least one trench and a top surface of thedielectric layer, the barrier layer having a non-uniform thickness, andselectively thinning at least a first portion of the barrier layer usingone or more cycles comprising forming an oxidized layer in the firstportion of the barrier layer using a neutral beam oxidation and removingthe oxidized layer using an etching process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a side cross-sectional view of trenches formed in astructure, according to an embodiment of the invention.

FIG. 2 depicts a side cross-sectional view of the FIG. 1 structurefollowing formation of a barrier layer in the trenches using physicalvapor deposition, according to an embodiment of the invention.

FIG. 3 depicts a side cross-sectional view of the FIG. 1 structurefollowing formation of a barrier layer in the trenches using atomiclayer deposition, according to an embodiment of the invention.

FIG. 4 depicts a side cross-sectional view of the FIG. 2 structurefollowing oxidation of portions of the barrier layer, according to anembodiment of the invention.

FIG. 5 depicts a side cross-sectional view of the FIG. 4 structurefollowing removal of the oxidized portions of the barrier layer,according to an embodiment of the invention.

FIG. 6 depicts close up views of a cycling process to etch barriermaterial in a structure, according to an embodiment of the invention.

FIG. 7 depicts a plot of the depth of oxidation using a neutral beamoxidation process, according to an embodiment of the invention.

FIG. 8 depicts a plot of the depth of oxidation using another neutralbeam oxidation process, according to an embodiment of the invention.

DETAILED DESCRIPTION

Illustrative embodiments of the invention may be described herein in thecontext of illustrative methods for forming barrier layers in trenchesand/or vias, along with illustrative apparatus, systems and deviceshaving barrier layers formed using such methods. However, it is to beunderstood that embodiments of the invention are not limited to theillustrative methods, apparatus, systems and devices but instead aremore broadly applicable to other suitable methods, apparatus, systemsand devices.

As semiconductor and other electronic structures continue to shrink insize, it is becoming more difficult to fill trenches and vias formed insuch structures. Liners or barriers formed on the sidewalls of trenchesand vias may be used to facilitate filling of trenches and/or vias to beused for interconnects in a resulting structure. As an example, liner orbarrier scaling below 3 nanometers (nm) for copper (Cu) interconnects isdesired for beyond 7 nm technology.

FIG. 1 depicts a side cross-sectional view 100 of a substrate 102 and adielectric layer 104, with trenches 105 formed in the dielectric layer104. The substrate 102 may be formed of silicon carbide (SiC), siliconcarbon nitride (SiCN), SiCNH, silicon nitride oxide (SiNO) and variousother dielectric capping materials. The substrate 102 may range inthickness from 1 to 500 angstroms (Å) in some embodiments. Thedielectric layer 104 may be formed of various dielectrics, includingultra low-K (ULK) dielectrics. The dielectric layer 104 may range inthickness from 5 to 2000 Å in some embodiments. To facilitate formationof interconnects, it is desirable to form a liner or barrier layer inthe trenches 105. The trenches 105 may be formed using single or dualdamascene techniques. FIGS. 2 and 3 show examples of barrier layersformed using physical vapor deposition (PVD) and an atomic layerdeposition (ALD) or post-dielectric reactive-ion etching (RIE).

While FIGS. 1, 2, 3, 4 and 5 show a structure having three trenches ofequal size, this is not a requirement. A structure may have any numberof trenches, with different trenches having different depths, thickness,heights, etc. In addition, spacing between trenches need not be uniform.One or more vias that extend through the entirety of the dielectriclayer may also be formed in some embodiments, possibly with one or moretrenches or blind vias in the same structure.

FIG. 2 shows a side cross-sectional view 200 of the FIG. 1 structurefollowing formation of barrier layer 206 by PVD. The barrier layer 206,also referred to herein as a liner, may be formed of tantalum (Ta),tantalum nitride (TaN), titanium (Ti), titanium nitride (TiN), a bilayerof TaN/Ta, or other suitable material. As shown in FIG. 2, the thicknessof barrier layer 206 may vary in different portions of the trenches 105.The thickness of the barrier layer 206 on the top of the dielectriclayer 104 and at the bottom of the trenches 105 may be approximately 30Å, and more generally range from 5 to 60 Å in some embodiments. In otherportions, such as on the sidewalls of the trenches 105, the barrierlayer 206 is thinner due to the poor step coverage of the barrier layer206 formed using PVD.

The use of PVD to form barrier layer 206 provides certain advantages.For example, PVD modifies the dielectric layer 104, throughdensification and/or etching, to provide a flared top gap opening of thetrenches 105 as well as additional area at the bottom of trenches 105via corner and/or bottom sharpening. The flared top gap opening andadditional area are caused by the PVD interacting with the dielectriclayer 104, which may be a ULK dielectric such as porous SiCOH (p-SiCOH),porous SiCNO (p-SiCNO), porous SiNCH (p-SiNCH), etc. formed via chemicalvapor deposition (CVD).

The barrier layer 206 formed via PVD, however, also has certaindrawbacks. As described above, the thickness of the barrier layer 206formed using PVD is not uniform. For example, the portions of thebarrier layer 206 on the top of dielectric layer 104 and on the bottomof the trenches 105 may be thicker than desired, while the portions ofthe barrier layer 206 on sidewalls of the trenches 105 may be a suitablethickness. It is to be appreciated, however, that in some instances itmay be desired to thin the barrier layer 206 formed on the sidewalls ofthe trenches 105. The techniques described herein for thinning thebarrier layer 206 formed on the bottom of the trenches 105 may also beused to thin the barrier layer 206 on sidewalls of the trenches 105 insuch cases.

In some embodiments, it is desired for the barrier layer 206 to be asthin as possible, so as to maximize area for Cu interconnects to achieveresistance targets. As an example, some structures may haveapproximately 50% of the total interconnect area being non-Cu material.An etch-back process, such as an argon (Ar) sputter, is a potentialsolution for scaling thickness of the barrier layer, but re-depositionof the sidewalls of trenches 105 using such techniques may preventcomplete scaling of the barrier layer 206.

FIG. 3 shows a side-cross sectional view 300 of the FIG. 1 structurefollowing formation of barrier layer 306 using ALD or a post dielectricME. The barrier layer 306 may be formed of materials similar to that ofbarrier layer 206, but of different composition. The barrier layer 306,formed using ALD, may have a ratio of Ta to N of approximately 1:1. Thebarrier layer 206, formed using PVD, may have approximately 30% N.Increasing N content increases resistivity, and thus PVD may bepreferred to ALD. While ALD can provide for uniform thickness of thebarrier layer 306, the barrier layer 306 formed using ALD has higherresistivity relative to the barrier layer 206 formed using PVD. Inaddition, ALD does not cause the flared openings or flattening of thebottom of trenches 105 shown in FIG. 2 using PVD. Thus, ALD does notprovide the fill advantages that the use of PVD does.

In some embodiments, a cycling process is used to etch barrier material206 in the FIG. 2 structure, so as to achieve the benefits of PVD withrespect to the flared openings and flattened bottoms of trenches 105while achieving scalability of the thickness of the barrier layer 206comparable to or greater than that of using ALD.

FIG. 4 depicts a side cross-sectional view 400 of the FIG. 2 structurefollowing oxidation of portions of the barrier layer 206 using a neutralbeam oxidation 401 to form oxidized layers 407. As shown, the oxidizedlayer 407 is formed on the top of the dielectric 104 as well as at thebottoms of the trenches 105. The neutral beam oxidation 401 uses aneutral atom beam treatment of low energy oxygen (O) particles, e.g., onthe range of 10-100+ electronvolts (eV). The neutral atom beam treatmentis electrically neutral, and provides surface penetration of 1-3 nm. Asan example, accelerated neutral atom beam (ANAB) treatments of 10-100 eVcan form an amorphized layer such as oxidized layer 407 of less than 3nm thickness. In a specific example wherein the barrier layer 206 isformed of Ta or TaN, the neutral beam oxidation 401 oxidizes the top5-10 Å of the barrier layer.

The neutral beam oxidation 401 may be made highly directional, such thatonly the top of the dielectric 104 and the bottom of trenches 105receive sufficient oxidation to form the surface oxidation layer 407.While it is possible for portions of the sloped sidewall to be hit bythe neutral beam oxidation 401, the highly directional nature of theneutral beam oxidation 401 means that any oxidation on the sidewalls ofthe trenches 105 will be minimal in comparison to the oxidation at thetop of the dielectric 104 and the bottom of the trenches 105.

Modified etch-K chemistries, with no oxidizer and low 02, may be used toremove the surface oxidation layer 407. U.S. patent application Ser. No.15/131,157, filed Apr. 18, 2016 and titled “Selective and Non-SelectiveBarrier Layer Wet Removal,” which is commonly assigned herewith andincorporated by reference herein in its entirety, provides details ofetchant chemistries referred to herein as etch-K chemistries. Someembodiments may utilize modified versions of the etch-K chemistriesdescribed in U.S. patent application Ser. No. 15/131,157. For example,modified etch-K chemistries used in some embodiments do not utilizehydrogen peroxide (H₂O₂), such that the etchant is not capable ofcontinuous etching of the barrier layer (e.g., Ta or TaN), and insteadonly etches the oxidized layer 407.

For example, such a modified etch-K chemistry includes a selective etchthat allows barrier layer 206 (e.g., TaN) to be removed selective todielectric layer 104 (e.g., a ULK material) and comprises 10 grams/liter(g/L) Benzotriazole (BTA)+0.5 g/L cyclohexanediamininetetraaceticacid(CDTA)+potassium hydroxide (KOH) in deionized (DI) water at a pH in therange of about 4 to about 12. Etching can be performed at temperaturesranging from about 25° C. to about 70° C. Other possible variations forthe modified etch-K chemistry include, but are not necessarily limitedto: (a) replacing KOH by another alkaline metal hydroxide, such as, forexample, one of LiOH, NaOH, RbOH, CsOH, and combinations thereof, atconcentration ranges of about 0.001M to about 0.1M (molar); (b)replacing CDTA by another peroxide stabilizer, such as, for example, oneof diethylenetriaminepenta(methylene-phosphonic acid) (DTPMPA) andethylenediaminetetraacetic acid (EDTA) at concentration ranges of about0.1 g/L to about 1 g/L; and (c) replacing BTA by another corrosioninhibitor, such as, for example, one of 1,2,3 triazole, 1,3,4 triazole,1,2,4 triazole, imidazole, methyl-thiol-triazole, thiol-triazole,triazole acid, 5-methyl-1H-benzotriazole, at concentration ranges ofabout 0.1 g/L to about 10 g/L. The above described modified etch-Kchemistry, in addition to selectively etching barrier layer 206 (e.g.,TaN) with respect to dielectric layer 104 (e.g., an ULK material), mayalso be used to etch selective to copper (Cu), cobalt (Co) and ruthenium(Ru), such that the barrier layer 206 comprising TaN can be selectivelyremoved with respect to a structure comprising Cu, Co and Ru.

Barrier layer 206 may also be selectively recessed along with Cu in asingle etching process using, for example, a modified etch-K chemistrycomprising 10 g/L BTA+0.1 M (moles) ammonia (NH₃)+0.5 g/L CDTA+KOH in DIwater at a pH range of about 4 to about 12. Etching can be performed ata temperature range of about 25° C. to about 70° C. Other possiblevariations for the modified etch-K chemistry include, but are notnecessarily limited to (a) replacing KOH by another alkaline metalhydroxide, such as, for example, one of LiOH, NaOH, RbOH, CsOH, andcombinations thereof, at concentration ranges of about 0.001M to about0.1M (molar); (b) replacing CDTA by another peroxide stabilizer, suchas, for example, one of DTPMPA and EDTA at concentration ranges of about0.1 g/L to about 1 g/L; and (c) replacing BTA by another corrosioninhibitor, such as, for example, one of 1,2,3 triazole, 1,3,4 triazole,1,2,4 triazole, imidazole, methyl-thiol-triazole, thiol-triazole,triazole acid, 5-methyl-1H-benzotriazole, at concentration ranges ofabout 0.1 g/L to about 10 g/L. NH₃ in water can be from one of thesources ammonium hydroxide (NH₄OH), ammonium phosphate, or ammoniumdihydrogen phosphate. Other complexing agents such as, bidentate ortridentate copper complexants including amino carboxylic acids (aminoacids), amino phosphonic acids, di and tri-carboxylic acids, di andtri-phosphonic acids, carboxyphosphonic acids, or combinations thereof,can be used in place of NH₃. The above-described modified etch-Kchemistry selectively etches both TaN and Cu with respect to ULKmaterials, and also selectively etches TaN and Cu with respect to Co andRu, so that a barrier layer 206 comprising TaN and another layercomprising Cu can both be selectively removed in the same etch step withrespect to ULK materials and/or Co and Ru. The etch selectivity of TaNwith respect to Cu can be altered by modifying amounts of ammonia, whichcan be added via NH₄OH.

FIG. 5 shows a side cross-sectional view 500 of the FIG. 4 structurefollowing removal of the oxidized layer 407, which may be achieved usingone of the modified etch-K chemistries described above. Thus, as shown,the original barrier layer 206 is thinned where the oxidized layer 407is formed and removed to produce barrier layer 206′. In someembodiments, the neutral beam oxidation 401 and etching using a modifiedetch-K chemistry may be repeated in cycles to perform an atomic layeretch (ALE) or digital etch of the barrier layer 206 to a desiredthickness while maintaining the trench profile modifications provided byPVD described above with respect to FIG. 2.

FIG. 6 depicts side cross-sectional views 600, 625 and 650 of a cyclingprocess to etch barrier material. The views 600, 625 and 650 may beconsidered as close-up views of a bottom wall of one of the trenches 105in FIGS. 2, 4 and 5, respectively. View 600 shows a dielectric layer 604and barrier layer 606 formed over the dielectric layer 604. An O neutralbeam, having an energy in the range of 1-100 eV, is appliedperpendicular to the surface of barrier layer 606 to form the structureshown in view 625, which has oxidized layer 607. Next, the oxidizedlayer 607 is removed as shown in view 650. In the view 650, the originalbarrier layer is thinned to form barrier layer 606′. The process shownin views 600, 625 and 650 may be cycled or repeated to thin the barrierlayer 606′ further. As will be appreciated, the number of cycling stepsmay vary as needed to produce a desired thickness of the barrier layer.For example barrier layer 606 may have a thickness of 30 Å, whileoxidized layer 607 may have a thickness of 2-10 Å such that the barrierlayer 606′ has thickness of 20-28 Å. The low landing energy of the Oneutral beam, in some embodiments, does not permit thicker oxidizedlayers to be formed. Thus, to remove a desired amount of the barrierlayer 606 it may be necessary to use multiple cycles.

FIGS. 7 and 8 show plots 700 and 800, respectively, of the depth ofoxidation using different neutral beam oxidation processes. For example,plot 700 shows a 10 eV O into TaN neutral beam oxidation, while plot 800shows a 50 eV O into TaN neutral beam oxidation. Plots 700 and 800 showthe difference in ion range, straggle, skewness and kurtosis using the10 ev and 50 eV O into TaN neutral beam oxidations. As illustrated, theO beam at these energies cannot penetrate and oxidize the entirety ofthe barrier layer, allowing for a controlled cyclic removal process toprovide precise control of the thickness of the barrier layer.

In some embodiments, a method of forming a semiconductor structurecomprises forming at least one trench in a dielectric layer, forming abarrier layer on a bottom of said at least one trench, sidewalls of saidat least one trench and a top surface of the dielectric layer, thebarrier layer having a non-uniform thickness, and selectively thinningat least a first portion of the barrier layer using one or more cyclescomprising forming an oxidized layer in the first portion of the barrierlayer using a neutral beam oxidation and removing the oxidized layerusing an etching process. Forming the barrier layer may utilize PVD,where forming the barrier layer modifies a shape of said at least onetrench by forming a flared top gap opening of said at least one trenchand additional area at the bottom of said at least one trench such thata top of said at least one trench and the bottom of said at least onetrench are wider than sidewalls of said at least one trench. Theadditional area may be formed by flattening the bottom of said at leastone trench.

Each cycle of thinning the first portion of the barrier layer maycomprise atomic layer etching that maintains the modified shape of saidat least one trench. Also, each cycle of thinning the first portion ofthe barrier layer may remove 2-10 Å of the thickness of the barrierlayer.

The first portion of the barrier layer may comprise at least one of thebottom of said at least one trench and the top surface of the dielectriclayer. A thickness of the first portion of the barrier layer, prior toselectively thinning the first portion of the barrier layer, may begreater than a thickness of the barrier layer on sidewalls of said atleast one trench.

The dielectric layer may comprise a ULK dielectric material, and thebarrier layer may comprise one of Ta and TaN. The neutral beam oxidationmay utilize an oxygen neutral beam that transforms a top of the firstportion of the barrier layer to tantalum oxide or a tantalum oxynitride. Each cycle of thinning the first portion of the barrier layerremoves a thickness of 2 to 10 angstrom of the first portion of thebarrier layer. The etching process may utilize an etchant that etchestantalum oxide and tantalum oxy nitride selective to the ULK dielectricmaterial. The oxygen neutral beam has an energy in the range of 1 to 100electronvolts. Selectively thinning the first portion of the barrierlayer comprises utilizing two or more cycles of the oxygen neutral beamhaving an energy of approximately 50 electronvolts, or two or morecycles of the oxygen neutral beam having an energy of approximately 10electronvolts. In some embodiments, each of the cycles utilizes aneutral beam oxidation having a same energy level, while in otherembodiments two or more of the cycles utilize neutral beam oxidationshaving different energy levels.

In some embodiments, a semiconductor structure comprises a dielectriclayer having at least one trench formed therein and a barrier layerformed on a bottom of said at least one trench, sidewalls of said atleast one trench and a top surface of the dielectric layer. Said atleast one trench comprises a flared top gap opening and additional areaat the bottom such that a top of said at least one trench and the bottomof said at least one trench are wider than sidewalls of said at leastone trench. A thickness of the barrier layer on the bottom of said atleast one trench and a thickness of the barrier layer on the top surfaceof the dielectric layer is controlled using one or more cyclescomprising forming an oxidized layer using a neutral beam oxidation andremoving the oxidized layer using an etching process, such that thethickness of the barrier layer on the bottom of said at least one trenchand the thickness of the barrier layer on the top surface of thedielectric layer is substantially the same as the thickness of thebarrier layer on the sidewalls of said at least one trench. The barrierlayer may comprises one of Ta and TaN.

It is to be appreciated that the barrier layer may not have a uniformthickness on the sidewalls of said at least one trench. Thus, the phrasesubstantially the same in this context refers to a maximum thickness ofthe sidewalls of said at least one trench. Also, the phrasesubstantially the same is intended to mean that the thickness need notbe exactly the same as one another, just within a defined threshold ofone another. This threshold tolerance may vary depending on the needs ofa particular application or device. In some embodiments, this thresholdtolerance may be an absolute number, such as the amount of barrier layerthat may be removed in one cycle, e.g., 2-10 Å. For example, if onecycle can be calibrated so as to remove 3 Å thickness of the barrierlayer, the thickness at the bottom of the trenches and on the sidewallsof the trenches may be considered substantially the same if they arewithin 3 Å of one another. In other embodiments, the threshold tolerancemay be a percentage difference, such as 5%, 10%, etc. The particularpercentage may also be based on the amount of barrier layer that may beremoved in one cycle.

In some embodiments, a method of forming a semiconductor structurecomprises forming at least one trench in a dielectric layer, depositinga barrier layer in said at least one trench and on a top surface of thedielectric layer using physical vapor deposition, the physical vapordeposition modifying a profile of said at least one trench such thatsaid at least one trench comprises a flared top gap opening andadditional area at the bottom such that a top of said at least onetrench and the bottom of said at least one trench are wider thansidewalls of said at least one trench, and controlling a thickness ofthe barrier layer by selectively thinning one or more portions of thebarrier layer using one or more cycles comprising forming an oxidizedlayer using a neutral beam oxidation and removing the oxidized layerusing an etching process.

Semiconductor devices and methods for forming same in accordance withthe above-described techniques can be employed in various applications,hardware, and/or electronic systems. Suitable hardware and systems forimplementing embodiments of the invention may include, but are notlimited to, personal computers, communication networks, electroniccommerce systems, portable communications devices (e.g., cell and smartphones), solid-state media storage devices, functional circuitry, etc.Systems and hardware incorporating the semiconductor devices arecontemplated embodiments of the invention. Given the teachings providedherein, one of ordinary skill in the art will be able to contemplateother implementations and applications of embodiments of the invention.

In some embodiments, the above-described techniques are used inconnection with semiconductor devices that may require, for example,complementary metal-oxide semiconductors (CMOSs),metal-oxide-semiconductor field-effect transistors (MOSFETs), and/or finfield-effect transistors (FinFETs). By way of non-limiting example, thesemiconductor devices can include, but are not limited to CMOS, MOSFET,and FinFET devices, and/or semiconductor devices that use CMOS, MOSFET,and/or FinFET technology.

Various structures described above may be implemented in integratedcircuits. The resulting integrated circuit chips can be distributed bythe fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A method of forming a semiconductor structure,comprising: forming at least one trench in a dielectric layer; forming abarrier layer on a bottom of said at least one trench, sidewalls of saidat least one trench and a top surface of the dielectric layer, thebarrier layer having a non-uniform thickness; and selectively thinningat least a first portion of the barrier layer using one or more cyclescomprising forming an oxidized layer in the first portion of the barrierlayer using a neutral beam oxidation and removing the oxidized layerusing an etching process.
 2. The method of claim 1, wherein forming thebarrier layer comprises using a physical vapor deposition.
 3. The methodof claim 2, wherein forming the barrier layer modifies a shape of saidat least one trench by forming a flared top gap opening of said at leastone trench and an additional area at the bottom of said at least onetrench such that a top of said at least one trench and the bottom ofsaid at least one trench are wider than sidewalls of said at least onetrench.
 4. The method of claim 3, wherein the additional area is formedby flattening the bottom of said at least one trench.
 5. The method ofclaim 3, wherein each cycle of thinning the first portion of the barrierlayer comprises atomic layer etching that maintains the modified shapeof said at least one trench.
 6. The method of claim 5, wherein eachcycle of the thinning the first portion of the barrier layer removes2-10 angstroms of the thickness of the barrier layer.
 7. The method ofclaim 1, wherein: the first portion of the barrier layer comprises atleast one of the bottom of said at least one trench and the top surfaceof the dielectric layer; and prior to selectively thinning the firstportion of the barrier layer, a thickness of the first portion of thebarrier layer is greater than a thickness of the barrier layer onsidewalls of said at least one trench.
 8. The method of claim 1, whereinthe dielectric layer comprises an ultra low-k (ULK) dielectric material.9. The method of claim 8, wherein the barrier layer comprises one oftantalum and tantalum nitride.
 10. The method of claim 9, wherein theneutral beam oxidation utilizes an oxygen neutral beam that transforms atop of the first portion of the barrier layer to tantalum oxide or atantalum oxy nitride.
 11. The method of claim 10, wherein each cycle ofthinning the first portion of the barrier layer removes a thickness of 2to 10 angstrom of the first portion of the barrier layer.
 12. The methodof claim 10, wherein the etching process utilizes an etchant that etchestantalum oxide and tantalum oxy nitride selective to the ULK dielectricmaterial.
 13. The method of claim 10, wherein the oxygen neutral beamhas an energy in the range of 1 to 100 electronvolts.
 14. The method ofclaim 13, wherein selectively thinning the first portion of the barrierlayer comprises utilizing two or more cycles of the oxygen neutral beamhaving an energy of approximately 50 electronvolts.
 15. The method ofclaim 13, wherein selectively thinning the first portion of the barrierlayer comprises utilizing two or more cycles of the oxygen neutral beamhaving an energy of approximately 10 electronvolts.
 16. The method ofclaim 1, wherein each of the cycles utilizes the neutral beam oxidationhaving a same energy level.
 17. The method of claim 1, wherein two ormore of the cycles utilize neutral beam oxidations having differentenergy levels.
 18. A method of forming a semiconductor structure,comprising: forming at least one trench in a dielectric layer;depositing a barrier layer in said at least one trench and on a topsurface of the dielectric layer using a physical vapor deposition, thephysical vapor deposition modifying a profile of said at least onetrench such that said at least one trench comprises a flared top gapopening and an additional area at a bottom such that a top of said atleast one trench and the bottom of said at least one trench are widerthan sidewalls of said at least one trench; and controlling a thicknessof the barrier layer by selectively thinning one or more portions of thebarrier layer using one or more cycles comprising forming an oxidizedlayer using a neutral beam oxidation and removing the oxidized layerusing an etching process.